时 间：2021年10月16日上午10:00am – 12:00pm (Beijing Time)
地 点：华中科技大学 光学与电子信息学院 新光电大楼C115
报告人：李学清副教授， 清华大学
邀请人：王超研究员
报告摘要：
虽然在后摩尔时代人工智能计算系统中的“存储墙”问题变得越来越严重，铁电器件仍被认为是一较有前景的备选方案。 这种预测源于铁电器件独特的器件特性及集成化方面的潜力。本报告旨在提供一种基于铁电器件的新型存储和计算技术，以满足新兴智能应用的低功耗和高性能需求。通过一些新颖的电路设计和架构优化示例，本报告将展示高能效存储器以及存内计算协同设计方面的探索成果。
While the “memory wall” problem becomes more severe in intelligent computing systems in the post-Moore’s era, ferroelectric devices have been considered as a promising candidate. Such a prediction originates from the unique device characteristics and integration potential. This talk aims at providing a new category of memory and computing techniques based on ferroelectric devices, so as to meet the power and performance requirement of emerging intelligent applications. With a few examples of novel circuit design and architecture optimizations, this talk will showcase the new design space exploration for energy-efficient memories and memory-computing synergies.
报告人介绍：
李学清，清华大学电子系副教授，国家人才计划青年项目专家，IEEE高级会员。2007年和2013年分别获得清华大学电子系学士和博士学位，2013年至2017年于美国宾州州立大学从事博士后研究。研究方向主要是数字模拟混合信号集成电路，特别包括基于新原理器件和计算方法的新兴智能加速电路与系统，是多个国家自然科学基金、科技部重点研发计划和企业联合研究项目的负责人。已发表百余篇论文，拥有二十余份中美专利。曾获ASP-DAC、HPCA、IEEE TMSCS和研究中心DARPAR LEAST的最佳论文，论文入选IEEE Micro Top Picks，并担任ASP-DAC、GLSVLSI、ICCAD等多个国际会议TPC成员。
Dr.XueqingLi isan associate professor in the Department of Electronics of Tsinghua University, an expert in the youth project of the National Talents Program, and a senior member of IEEE. In 2007 and 2013, he received the bachelor's degree and PhD from the Department of Electronics of Tsinghua University, respectively. From 2013 to 2017, he was engaged in postdoctoral research at Pennsylvania State University in the United States. His research interest is mainly digital and analog mixed-signal integrated circuits, especially emerging intelligent acceleration circuits and systems based on new devices and calculation methods. He is in charge of several national natural science foundations, key research and development programs of the Ministry of Science and Technology, and joint research projects of enterprises. He has published more than 100 papers and has more than 20 Chinese and American patents. He has won the best papers of ASP-DAC, HPCA, IEEE TMSCS and research center DARPAR LEAST. His paper was selected as IEEE Micro Top Picks and now he serves as a TPC member of ASP-DAC, GLSVLSI, ICCAD and other international conferences.
