主 题：
三维集成的过去和未来（
3-D Integration: Past and Future
）
时 间： 2019 年 9月 2 日 15 : 00 - 16: 00
地 点：
西一楼一楼大会议室
报告人：
张国飙 博士， 南方科技大学
邀请人：
余国义、王超 研究员
报告摘要：
在7nm节点上，晶体管没有多少代可以进一步向前演进了。随着未来晶体管的尺寸缩小，这种趋势预计在2026-2030年左右停滞。当前三维集成被认为是最有希望的候选方案之一。三维集成可以在两个层次上进行：集成电路（IC）层次（即单片3D-IC）和封装层次（即3D封装）。在本次演讲中涵盖了工业界成熟的单片3D-IC和3D封装的介绍。也将讨论单片3D-IC和3D封装开发过程中的多个重要里程碑。
At the 7nm node, transistors do not have many generations to go. As future scaling of transistors is expected to become stalled around year 2026-2030, 3-D Integration is now considered as one of the most promising candidates. The 3-D integration can be carried out at two levels: integrated circuit (IC) level (i.e. monolithic 3D-IC) and packaging level (i.e. 3D-packaing). In this talk, both monolithic 3D-IC and 3D-packaing will be covered by industrial veterans. Several important milestones during the development of the monolithic 3D-IC and 3D-packaing will be discussed.
报告人介绍：
张国飙 博士 研究教授 2019年加入南方科技大学深港微电子学院。1995年在伯克利大学获得博士学位，导师是加州大学伯克利分校名誉教授、台积电荣誉教授Chenming HU(胡正明)。他在德州仪器公司工作了五年，后来创办了3D-ROM公司。张博士是三维内存和三维计算的发明者。他拥有超过100项专利，其中大部分是美国专利。英特尔的3D Xpoint和YMTC的Xtacking使用了张博士的专利技术
Dr. Guobiao ZHANG is a research professor in Hong-Kong Microelectronics College of Southern University of Science and Technology at Shenzhen since 2019. He received Ph.D. degree from Berkeley under Chenming HU (University of California, Berkeley Professor Emeritus and TSMC Distinguished Professor Emeritus) in 1995. He worked at Texas Instrument for five years before started 3D-ROM INC. Dr. Zhang is an inventor of 3-D memory and 3-D computation. He owns over 100 hundred patents, most of which are the U.S. patents. Intel’s 3D-XPoint and YMTC’s Xtacking used Dr. Zhang’s patented technologies.
