时 间： 2019 年 9月 4 日 16 : 00 - 17: 00
南五楼 612 学术报告厅
The demand of small-sized DC-DC converters used as power sources to supply suitable voltage increases rapidly. The DC-DC converter is mainly composed of IC and SMD chip components. Through the integration of inductors, capacitors and resistors into one monolithic chip component, the integrated component will offer better performance and save more occupied space on the printed circuit board during assembling. Therefore, the passive component will become a compact integrated passive component. Mismatched densification kinetics and severe chemical reactions between the different materials could generate undesirable defects such as delamination, cracks and camber in the final products. In this study, the cofiring behavior and interfacial interaction between a low K LTCC material and NiCuZn ferrites at 900 oC were studied. It was observed that the delamination occurred at the interface between LTCC and NiCuZn ferrites added with Bi2O3. It may be due to the Bi enriched at the interface and diffused into LTCC, which shifted the densification curve of LTCC towards low temperature, and hence resulted in the shrinkage mismatch between LTCC and NiCuZn ferrites.