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光电信息大讲堂第五十八讲:“集成电路先导工艺”系列学术报告

作者: 时间:2017-06-06 点击数:

报告人:鲁汶仪器 CTO,Prof. Mikhail Baklanov
报告名称:Advanced  Interconnects in Semiconductor Manufacturing beyond 10nm Technode
报告时间:2017年 3 月 9日上午 09 : 00 – 09 : 50
♥ 报告摘要:
               This talk covers the challenges appearing during the integration of ultra low-k dielectrics, since a proper understanding of these issues is essential for downscaling of the interconnect system. The extreme vulnerability of porous low-k to processing - induced damage (accompanied with the loss of dielectric performance and reliability) demands a continuous innovation of materials, processes and integration approaches. This talk will also review the status of developments in new materials, new barriers, new conductors, and innovation  integration solutions in 10nm technode and beyond.
              这个报告介绍了超低介电常数材料在集成过程中所出现的一些问题,正确理解这些问题是缩减互连系统的关键。伴随着介电性能和可靠性的损失,多孔低介电常数材料的致命弱点在工艺过程中不断呈现,为了降低损害,要求我们需要在材料、工艺和集成方法方面不断创新。本次报告还将介绍在10nm技术下,在新材料、新壁垒、新导体和整体方案等方面的发展状况。
♥   报告人简介:
               Prof. Mikhail R. Baklanov graduated from Novosibirsk State University (Russia). He obtained his PhD degree in Chemical Sciences in 1976. He worked at the Institute Semiconductor Physics of Russian Academy of Sciences and held the positions of Senior Researcher and Head of Laboratory. In 1995–2001, he worked at IMEC, Leuven, Belgium as a visiting Professor, and in 2001–2003 as R&D Director in XPEQT, Switzerland/ Belgium. In 2003–2016 he was working as a Principal Scientist at IMEC, Belgium. Since March 2016, he is working as CTO in Leuven instruments, Leuven, Belgium. He has been serving as a member of Organizing Committees of several international conferences. He has published more than 600 publications, including more than 300 papers in peer reviewed journals and >60 invited presentations at International conferences. He has granted more than 35 patents, and has been Editor and contributor of several books.
             Mikhail Baklanov教授毕业于俄罗斯新西伯利亚州立大学。在1976年获得化学博士学位。他在俄罗斯科学院半导体物理所任职,并获得高级研究员职称。1995-2001年,他作为客座教授在比利时鲁汶IMEC工作,2001-2003年担任瑞典和比利时XPEQT公司研发总监。2003-2016年,担任比利时IMEC首席科学家。到2016年,担任比利时鲁汶仪器CTO。他是很多国际会议组织委员会的成员之一。发表论文超过600篇,包括同行评议期刊中的300多篇论文,超过60次被邀请在国际会议上演讲。他拥有超过35项专利,是数本著作的作者

 

报告人:中科院微电子研究所研究员     中国科学院大学未来技术学院教授黄成军
报告名称:后摩尔时代的微纳传感器技术及其在医疗健康领域的应用
报告时间:2017年 3 月 9日上午 09 : 50 – 10 : 30
♥ 报告摘要:
             健康电子是后摩尔时代微电子技术的重要发展方向之一。微纳电子技术与微流控技术的结合,将催生众多的新技术、新工具、新产品,助力生命科学、医学研究及应用。
            本报告将介绍当前微流控技术在当前国内外学术界及产业界的现状,探讨当前微流控技术在生物医疗应用产业化道路上所面临的问题,并重点讨论微电子技术与微流控技术的联合运用,在稀有细胞分选、单细胞精准操控、检测等方面的所具有的独特优势,可能成为微流控技术大规模应用的趋势之一。最后,报告将介绍中科院微电子所在围绕“三微一大,即微电子、微流控、微侵入、大数据”等方面开展的研究工作。
♥   报告人简介:
                黄成军、工学博士,于2006年获华中科技大学微电子学专业博士学位,2007-2013年在比利时欧洲微电子中心(IMEC)任高级研究员。2014年,由中科院微电子所引进,任研究员,从事微纳传感器,生物——微机电系统(Bio-MEMS)方面的研究工作,2015年入选中科院“百人计划”。黄成军博士先后发表学术论文50多篇,申请国内外专利10余项。

报  告  人:鲁汶仪器CEO,许开东博士                                    
报告名称:Advanced Patterning for Logic & Memory Devices in 10nm Technode and Beyond
报告时间:2017年 3 月 9日上午 10 : 45 – 11: 25

♥ 报告摘要:
             This talk covers the status and challenges in the patterning solutions for advanced logic and memory devices. The main stream patterning routes is reviewed, including immersion-based solutions, EUV based solutions, and directed self-assembly based efforts. Multiple patterning  including (LE)x and SAMP is touched. The hard masks and key materials to enable the critical dimensions and patterning profiles were visited. The etching challenges for non-volatile metals in advanced memory devices are also discussed.
            本讲座涵盖了未来的逻辑和存储器件在图案化过程中存在的状况和挑战。回顾了主流的制图路线,包括基于浸泡、基于EUV和基于DSA的解决方案。介绍了(LE)x和SAMP等多层制图方法。硬掩膜和关键材料限制了图案形状。报告还介绍了未来存储器中非挥发性金属蚀刻所面临的挑战。
♥   报告人简介:
            Dr. Kaidong Xu currently serves as the CEO of Leuven Instruments based in Jiangsu and Belgium. Prior to that, Kaidong Xu served multiple leading R&D positions at imec vzw, Leuven, Belgium, including etch and lithography, responsible for patterning and overall etch strategy, focusing on logic and memory devices.  Prior to joining imec, he was senior process manager of wet applications at SEZ/Lam Research, from 2004 to 2010. Prior to that, he did research at imec on surface preparation and wet cleans, from 1999 to 2004. He has published over 150 papers and patents. He received his BSc in chemistry from Peking University in China, and his Ph.D. in chemistry from University of Leuven (KU Leuven) in Belgium. He received 1000plan grant in 2014.
          许开东博士是江苏鲁汶仪器和比利时鲁汶仪器的CEO。在此之前,许开东在比利时鲁汶IMEC担任多个研发部门的负责人,比如刻蚀和光刻部门,负责整个部门的运营和发展策略,专注于逻辑和存储器件研发。在2004-2010年,他担任SEZ/LAM研发湿法部门的高管。1999-2004年,他在IMEC研究表面处理和湿法方面的应用。他拥有超过150项著作和专利。本科毕业于北大化学专业,在比利时鲁汶大学获得化学博士学位。是2014年中组部千人专家之一。

 

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